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[Apologies for cross postings. Please re-distribute.] CALL FOR PAPERS International Journal of Embedded Systems (http://www.inderscience.com/catalogue/e/ijes/indexijes.html, Inderscience Publishers) Special Issue On Hardware-Software Codesign for Systems-on-Chip (http://www.cs.ccu.edu.tw/~pahsiung/ijes-codesign/) With the rapidly permeating global trend of adopting SoC (System-on-Chip) design technologies, traditional hardware-software codesign techniques need adaptation and revamping to satisfy the growing needs of complex system designs. This special issue is devoted to presenting state-of-the-art SoC codesign and coverification methodologies, languages, techniques, tools, system architectures, and related technologies. Prospective papers should be unpublished and present solid research work offering innovative contributions either from a methodological or application point of view. Topics of interest include (but are not limited to): * Design & Verification Methodologies * Design & Verification Languages * Design & Verification Tools * SoC Architectural Issues * SoC Physical Impact on Codesign * Nanotechnology and Codesign * Mixed-Signal in Codesign * Soft/Hard IP-reuse in Codesign * Embedded Software Issues * Embedded Hardware Issues * Communication Issues * Cosimulation Techniques * (Semi)-Formal Verification * Platform-Based Codesign Issues Prospective authors should follow the Inderscience IJES manuscript format described at the Journal site http://www.inderscience.com/catalogue/e/ijes/indexijes.html. An electronic copy of the complete manuscript in PDF format is to be submitted by e-mail to Pao-Ann Hsiung at hpa@computer.org, according to the following schedule. Manuscript due: December 1, 2003 Acceptance notification: January 16, 2004 Final manuscript due: January 31, 2004 Publication date: June 2004 Guest Editor Prof. Pao-Ann Hsiung Department of Computer Science and Information Engineering National Chung Cheng University Chiayi 621, Taiwan hpa@computer.org Editorial Board for this Special Issue: (ordered alphabetically) Jih-Ming Fu, Cheng-Shiu University of Technology, Taiwan Rajesh Gupta, University of California, Irvine, USA Thomas Henzinger, University of California, Berkeley, USA Luciano Lavagno, Politecnico di Torino, Italy Trong-Yen Lee, National Taipei University of Technology, Taiwan Win-Bin See, Aerospace Industrial Development Corporation, Taiwan Wayne Wolf, Princeton University, USA ------ Want more information? See the CrossGCC FAQ, http://www.objsw.com/CrossGCC/ Want to unsubscribe? Send a note to crossgcc-unsubscribe@sources.redhat.com
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